Electrolytic copper plating device (non-dissolving copper plating)
We would like to introduce a device that performs copper plating on the product pattern section using a vertical transport method.
The device can perform copper plating on the product pattern section. The process involves pre-treatment of the film foil, copper plating, rinsing, and drying, and is carried out using a roll-to-roll vertical transport method for both sides of the product. The reference dimensions of the device, excluding the control panel and ancillary equipment, are 20m (L) × 4.6m (W) × 4.4m (H). 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 1.0m/min ■ Material width: MAX 300mm ■ Material thickness: 25μm to 50μm ■ Processing surface: Both sides *For more details, please refer to the PDF document or feel free to contact us.
- 企業：SETO ENGINEERING 守谷事業所
- 価格：Other
